Kim, Jiyoung
Permanent URI for this collectionhttps://hdl.handle.net/10735.1/2484
Jiyoung Kim serves as Associate Professor in the Department of Materials Science and Engineering. His research interests include:
- Gate Stack Engineering for the Next Generation Complementary
- Metal-Oxide-Semiconductor (CMOS) Applications
- Nano-structure Materials and Devices for Nanoelectronics
- Novel Atomic Layer Deposition (ALD) Applications
- Novel Memory Device Materials, Fabrication and Applications
- Nano-sensor Fabrication and Applications
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Browsing Kim, Jiyoung by Author "0000-0003-0690-7423 (Young, CD)"
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Item Engineering The Palladium-WSe₂ Interface Chemistry for Field Effect Transistors with High-Performance Hole Contacts(Amer Chemical Soc, 2018-12-07) Smyth, Christopher M.; Walsh, Lee A.; Bolshakov, Pavel; Catalano, Massimo; Addou, Rafik; Wang, Luhua; Kim, Jiyoung; Kim, Moon J.; Young, Chadwin D.; Hinkle, Christopher L.; Wallace, Robert M.; 0000-0001-5566-4806 (Wallace, RM); 0000-0003-0690-7423 (Young, CD); 0000-0003-2781-5149 (Kim, J); 0000-0002-6688-8626 (Walsh, LA); 0000-0002-5485-6600 (Hinkle, CD); 0000-0002-5454-0315 (Addou, R); 70133685 (Kim, J); Smyth, Christopher M.; Walsh, Lee A.; Bolshakov, Pavel; Catalano, Massimo; Addou, Rafik; Wang, Luhua; Kim, Jiyoung; Kim, Moon J.; Young, Chadwin D.; Hinkle, Christopher L.; Wallace, Robert M.Palladium has been widely employed as a hole contact to WSe₂ and has enabled, at times, the highest WSe₂ transistor performance. However, there are orders of magnitude variation across the literature in Pd-WSe₂ contact resistance and I-ON/I-OFF ratios with no true understanding of how to consistently achieve high-performance contacts. In this work, WSe₂ transistors with impressive I-ON/I-OFF ratios of 10(6) and Pd-WSe₂ Schottky diodes with near-zero variability are demonstrated utilizing Ohmic-like Pd contacts through deliberate control of the interface chemistry. The increased concentration of a PdSeₓ intermetallic is correlated with an Ohmic band alignment and concomitant defect passivation, which further reduces the contact resistance, variability, and barrier height inhomogeneity. The lowest contact resistance occurs when a 60 min post-metallization anneal at 400 degrees C in forming gas (FG) is performed. X-ray photoelectron spectroscopy indicates this FG anneal produces 3x the concentration of PdSeₓ and an Ohmic band alignment, in contrast to that detected after annealing in ultrahigh vacuum, during which a 0.2 eV hole Schottky barrier forms. Raman spectroscopy and scanning transmission electron microscopy highlight the necessity of the fabrication step to achieve high-performance contacts as no PdSeₓ forms, and WSe₂ is unperturbed by room temperature Pd deposition. However, at least one WSe₂ layer is consumed by the necessary interface reactions that form PdSeₓ requiring strategic exploitation of a sacrificial WSe₂ layer during device fabrication. The interface chemistry and structural properties are correlated with Pd-WSe₂ diode and transistor performance, and the recommended processing steps are provided to enable reliable high-performance contact formation.Item Ferroelectric TiN/Hf₀.₅Zr₀.₅O₂/Tin Capacitors with Low-Voltage Operation and High Reliability for Next-Generation FRAM Applications(Institute of Electrical and Electronics Engineers Inc.) Kim, Si Joon; Mohan, Jaidah; Young, Chadwin D.; Colombo, Luigi; Kim, Jiyoung; Summerfelt, S. R.; San, T.; 0000-0003-0690-7423 (Young, CD); 0000-0003-2781-5149 (Kim, J); 70133685 (Kim, J); Kim, Si Joon; Mohan, Jaidah; Young, Chadwin D.; Colombo, Luigi; Kim, JiyoungIn this study, we investigated the ferroelectric properties of Hf₀.₅Zr₀.₅O₂ (HZO) thin films with different thicknesses (5-20 nm) deposited by atomic layer deposition for the development of future ferroelectric random access memory cells. HZO-based capacitors with a thickness of 5 nm exhibited a switching polarization of ~13 μC/cm² and a ferroelectric saturation voltage of 1.0 V as extracted from the pulse write/read measurements. Furthermore, we performed fatigue measurements and we found no degradation up to 10¹⁰ switching cycles at 1.2 V.Item Large Ferroelectric Polarization of TiN/Hf₀․₅Zr₀․₅0₂ Capacitors Due to Stress-Induced Crystallization at Low Thermal Budget(Amer Inst Physics, 2018-10-22) Kim, Si Joon; Narayan, Dushyant; Lee, Jae-Gil; Mohan, Jaidah; Lee, Joy S.; Lee, Jaebeom; Kim, Harrison S.; Byun, Young-Chul; Lucero, Antonio T.; Young, Chadwin D.; Summerfelt, Scott R.; San, Tamer; Colombo, Luigi; Kim, Jiyoung; 0000-0001-7335-1053 (Lee, JS); 0000-0001-9477-5728 (Byun, Y-C); 0000-0003-0690-7423 (Young, CD); 0000-0003-2781-5149 (Kim, J); 70133685 (Kim, J); Kim, Si Joon; Narayan, Dushyant; Lee, Jae-Gil; Mohan, Jaidah; Lee, Joy S.; Lee, Jaebeom; Kim, Harrison S.; Byun, Young-Chul; Lucero, Antonio T.; Young, Chadwin D.; Kim, JiyoungWe report on atomic layer deposited Hf₀․₅Zr₀․₅0₂ (HZO)-based capacitors which exhibit excellent ferroelectric (FE) characteristics featuring a large switching polarization (45 μC/cm²) and a low FE saturation voltage (~1.5V) as extracted from pulse write/read measurements. The large FE polarization in HZO is achieved by the formation of a non-centrosymmetric orthorhombic phase, which is enabled by the TiN top electrode (TE) having a thickness of at least 90nm. The TiN films are deposited at room temperature and annealed at 400 ⁰C in an inert environment for at least 1 min in a rapid thermal annealing system. The room-temperature deposited TiN TE acts as a tensile stressor on the HZO film during the annealing process. The stress-inducing TiN TE is shown to inhibit the formation of the monoclinic phase during HZO crystallization, forming an orthorhombic phase that generates a large FE polarization, even at low process temperatures.