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    • Silicon Etch Using SF₆/C₄F₈/Ar Gas Mixtures 

      Bates, Robert L.; Thamban, P. L. Stephan; Goeckner, Matthew J.; Overzet, Lawrence J.
      While plasmas using mixtures of SF₆, C₄F₈, and Ar are widely used in deep silicon etching, very few studies have linked the discharge parameters to etching results. The authors form such linkages in this report. The authors ...