IC Laser Trimming Speed-up Through Wafer-Level Spatial Correlation Modeling
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Laser trimming is used extensively to ensure accurate values of on-chip precision resistors in the presence of process variations. Such laser resistor trimming is slow and expensive, typically performed in a closed-loop, where the laser is iteratively fired and some circuit parameter (i.e. current) is monitored until a target condition is satisfied. Toward reducing this cost, we introduce a novel methodology for predicting the laser trim length, thereby eliminating the closed-loop control and speeding up the process. Predictions are obtained from wafer-level spatial correlation models, learned from a sparse sample of die on which traditional trimming is performed. Effectiveness is demonstrated on an actual wafer of lasertrimmed ICs.