Enhanced Thermal Conductivity in Cu/Diamond Composites by Tailoring the Thickness of Interfacial TiC Layer

dc.contributor.authorWang, Luhua
dc.contributor.authorLi, J.
dc.contributor.authorCatalano, Massimo
dc.contributor.authorBai, G.
dc.contributor.authorLi, N.
dc.contributor.authorDai, J.
dc.contributor.authorWang, X.
dc.contributor.authorZhang, H.
dc.contributor.authorWang, Jinguo
dc.contributor.authorKim, Moon J.
dc.contributor.utdAuthorWang, Luhua
dc.contributor.utdAuthorCatalano, Massimo
dc.contributor.utdAuthorWang, Jinguo
dc.contributor.utdAuthorKim, Moon J.
dc.date.accessioned2019-07-12T20:25:00Z
dc.date.available2019-07-12T20:25:00Z
dc.date.created2018-07-18
dc.descriptionFull text access from Treasures at UT Dallas is restricted to current UTD affiliates (use the provided Link to Article). Non UTD affiliates will find the web address for this item by clicking the "Show full item record" link, copying the "dc.relation.uri" metadata and pasting it into a browser.
dc.description.abstractDiamond particles reinforced Cu matrix (Cu/diamond) composites were fabricated by gas pressure infiltration using Ti-coated diamond particles with Ti coating from 65 nm to 850 nm. The scanning transmission electron microscopy (STEM) characterizes that the Ti coating transforms from elemental Ti to TiC after infiltration, and the crystallographic orientation relationship between diamond and TiC is [1 1 0]_{diamond}//[1 1 0]_{TiC} and (1 1 1)_{diamond}//(1 1 1)_{TiC}. The thermal conductivity of the Cu/Ti-diamond composites firstly increases and then decreases with increasing Ti coating thickness, giving a maximal value of 811 W m⁻¹ K⁻¹ at 220 nm Ti-coating layer. The results clearly manifest the effect of interfacial layer thickness on the thermal conductivity of Cu/diamond composites.
dc.description.departmentErik Jonsson School of Engineering and Computer Science
dc.description.sponsorshipNational Natural Science Foundation of China (No. 51571015), the National Key Research and Development Program of China (No. 2016YFB0402102), the International Science and Technology Cooperation Program of China (No. 2014DFA51610).
dc.identifier.bibliographicCitationWang, L., J. Li, M. Catalano, G. Bai, et al. 2018. "Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer." Composites Part A: Applied Science and Manufacturing 113: 76-82, doi:10.1016/j.compositesa.2018.07.023
dc.identifier.issn1359835X
dc.identifier.urihttps://hdl.handle.net/10735.1/6694
dc.identifier.volume113
dc.language.isoen
dc.publisherElsevier Ltd
dc.relation.urihttp://dx.doi.org/10.1016/j.compositesa.2018.07.023
dc.rights©2018 Elsevier Ltd. All rights reserved.
dc.source.journalComposites Part A: Applied Science and Manufacturing
dc.subjectMetallic composites
dc.subjectMaterials--Thermal properties
dc.subjectElectron microscopy
dc.subjectTitanium carbide
dc.subjectCopper
dc.subjectTitanium
dc.titleEnhanced Thermal Conductivity in Cu/Diamond Composites by Tailoring the Thickness of Interfacial TiC Layer
dc.type.genrearticle

Files

Original bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
JECS-3026-279793.13-LINK.pdf
Size:
164.87 KB
Format:
Adobe Portable Document Format
Description:
Link to Article

Collections