Role of Excess Ligand and Effect of Thermal Treatment in Hybrid Inorganic-Organic EUV Resists

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dc.contributor.authorMattson, Eric C.
dc.contributor.authorRupich, S. M.
dc.contributor.authorCabrera, Y.
dc.contributor.authorChabal, Yves J.
dc.contributor.utdAuthorMattson, Eric C.
dc.contributor.utdAuthorChabal, Yves J.
dc.date.accessioned2019-05-15T21:00:24Z
dc.date.available2019-05-15T21:00:24Z
dc.date.created2018-03-19
dc.descriptionFull text access from Treasures at UT Dallas is restricted to current UTD affiliates.
dc.description.abstractThe chemical structure and thermal reactivity of recently discovered inorganic-organic hybrid resist materials are characterized using a combination of in situ and ex situ infrared (IR) spectroscopy and X-ray photoemission spectroscopy (XPS). The materials are comprised of a small HfOx core capped with methacrylic acid ligands that form a combined hybrid cluster, HfMAA. The observed IR modes are consistent with the calculated modes predicted from the previously determined X-ray crystal structure of the HfMAA-12 cluster, but also contain extrinsic hydroxyl groups. We find that the water content of the films is dependent on the concentration of excess ligand added to the solution. The effect of environment used during post-application baking (PAB) is studied and correlated to changes in solubility of the films. In doing so, we find that hydroxylation of the clusters results in formation of additional Hf-O-Hf linkages upon heating, which in turn impacts the solubility of the films.
dc.description.departmentErik Jonsson School of Engineering and Computer Science
dc.identifier.bibliographicCitationEric C. Mattson, Sara M. Rupich, Yasiel Cabrera, Yves J. Chabal, "Role of excess ligand and effect of thermal treatment in hybrid inorganic-organic EUV resists," Proc. SPIE 10583, Extreme Ultraviolet (EUV) Lithography IX, 1058309 (19 March 2018); doi: 10.1117/12.2300064
dc.identifier.issn0277-786X
dc.identifier.urihttps://hdl.handle.net/10735.1/6483
dc.identifier.volume10583
dc.language.isoen
dc.publisherSPIE
dc.relation.urihttp://dx.doi.org/10.1117/12.2300064
dc.rights©2018 SPIE.
dc.source.journalProceedings of SPIE - The International Society For Optical Engineering
dc.subjectExtreme ultraviolet lithography
dc.subjectFourier transform infrared spectroscopy
dc.subjectHafnium oxide
dc.subjectMethacrylic acid
dc.subjectPhotoresists
dc.subjectCrystals
dc.subjectLigands
dc.subjectPhotoelectron spectroscopy
dc.subjectSolubility
dc.subjectX-rays
dc.titleRole of Excess Ligand and Effect of Thermal Treatment in Hybrid Inorganic-Organic EUV Resists
dc.type.genrearticle

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