Bai, G.Wang, LuhuaZhang, Y.Wang, X.Wang, JinguoKim, Moon J.Zhang, H.2020-02-042020-02-042019-04-121044-5803http://dx.doi.org/10.1016/j.matchar.2019.04.015https://hdl.handle.net/10735.1/7224Diamond particles reinforced Cu matrix (Cu/diamond) composites were prepared by alloying 0.1–1.0 wt% B to the Cu matrix in order to tailor the interface structure. The interface structure evolves from discrete triangular carbides into continuous jig-saw carbides depending on the availability of boron source in the Cu-B matrix. We report the highest thermal conductivity of 868 W/mK so far in boron-modified Cu/diamond composites, which originates from the discontinuous carbide interface in the Cu-B/diamond composites. The parallel connection of interfacial thermal resistances of the discontinuous carbide interface reduces the total interfacial thermal resistance and therefore promotes phonon transfer across the Cu/diamond interface. We clarify the formation mechanism of discontinuous carbide interface in the Cu-B/diamond composites and demonstrate the decisive role of discrete triangular carbides in enhancing thermal conductivity of Cu/diamond composites. The results help to establish the method of metal matrix alloying to prepare Cu/diamond composites with high thermal conductivity for thermal management applications. © 2019 Elsevier Inc.en©2019 Elsevier Inc.High-resolution electron microscopyMetallic compositesThermal conductivityMechanical alloyingBoronBoron compoundsCarbidesCopper alloysElectric connectorsJigsarticleBai, G., L. Wang, Y. Zhang, X. Wang, et al. 2019. "Tailoring interface structure and enhancing thermal conductivity of Cu/Diamond composites by alloying boron to the Cu matrix." Materials Characterization 152: 265-275, doi: 10.1016/j.matchar.2019.04.015152