Role of Excess Ligand and Effect of Thermal Treatment in Hybrid Inorganic-Organic EUV Resists

The chemical structure and thermal reactivity of recently discovered inorganic-organic hybrid resist materials are characterized using a combination of in situ and ex situ infrared (IR) spectroscopy and X-ray photoemission spectroscopy (XPS). The materials are comprised of a small HfOx core capped with methacrylic acid ligands that form a combined hybrid cluster, HfMAA. The observed IR modes are consistent with the calculated modes predicted from the previously determined X-ray crystal structure of the HfMAA-12 cluster, but also contain extrinsic hydroxyl groups. We find that the water content of the films is dependent on the concentration of excess ligand added to the solution. The effect of environment used during post-application baking (PAB) is studied and correlated to changes in solubility of the films. In doing so, we find that hydroxylation of the clusters results in formation of additional Hf-O-Hf linkages upon heating, which in turn impacts the solubility of the films.