Tailoring Interface Structure and Enhancing Thermal Conductivity of Cu/Diamond Composites by Alloying Boron to the Cu Matrix

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dc.contributor.authorBai, G.
dc.contributor.authorWang, Luhua
dc.contributor.authorZhang, Y.
dc.contributor.authorWang, X.
dc.contributor.authorWang, Jinguo
dc.contributor.authorKim, Moon J.
dc.contributor.authorZhang, H.
dc.contributor.utdAuthorWang, Luhua
dc.contributor.utdAuthorWang, Jinguo
dc.contributor.utdAuthorKim, Moon J.
dc.date.accessioned2020-02-04T19:22:39Z
dc.date.available2020-02-04T19:22:39Z
dc.date.created2019-04-12
dc.description.abstractDiamond particles reinforced Cu matrix (Cu/diamond) composites were prepared by alloying 0.1–1.0 wt% B to the Cu matrix in order to tailor the interface structure. The interface structure evolves from discrete triangular carbides into continuous jig-saw carbides depending on the availability of boron source in the Cu-B matrix. We report the highest thermal conductivity of 868 W/mK so far in boron-modified Cu/diamond composites, which originates from the discontinuous carbide interface in the Cu-B/diamond composites. The parallel connection of interfacial thermal resistances of the discontinuous carbide interface reduces the total interfacial thermal resistance and therefore promotes phonon transfer across the Cu/diamond interface. We clarify the formation mechanism of discontinuous carbide interface in the Cu-B/diamond composites and demonstrate the decisive role of discrete triangular carbides in enhancing thermal conductivity of Cu/diamond composites. The results help to establish the method of metal matrix alloying to prepare Cu/diamond composites with high thermal conductivity for thermal management applications. © 2019 Elsevier Inc.
dc.description.departmentErik Jonsson School of Engineering and Computer Science
dc.description.sponsorshipThis work is financially supported by the National Natural Science Foundation of China (No. 51571015), the National Key Research and Development Program of China (No. 2016YFB0402102) and the State Key Laboratory for Advanced Metals and Materials (No. 2018Z-27).
dc.identifier.bibliographicCitationBai, G., L. Wang, Y. Zhang, X. Wang, et al. 2019. "Tailoring interface structure and enhancing thermal conductivity of Cu/Diamond composites by alloying boron to the Cu matrix." Materials Characterization 152: 265-275, doi: 10.1016/j.matchar.2019.04.015
dc.identifier.issn1044-5803
dc.identifier.urihttp://dx.doi.org/10.1016/j.matchar.2019.04.015
dc.identifier.urihttps://hdl.handle.net/10735.1/7224
dc.identifier.volume152
dc.language.isoen
dc.publisherElsevier Inc.
dc.rights©2019 Elsevier Inc.
dc.source.journalMaterials Characterization
dc.subjectHigh-resolution electron microscopy
dc.subjectMetallic composites
dc.subjectThermal conductivity
dc.subjectMechanical alloying
dc.subjectBoron
dc.subjectBoron compounds
dc.subjectCarbides
dc.subjectCopper alloys
dc.subjectElectric connectors
dc.subjectJigs
dc.titleTailoring Interface Structure and Enhancing Thermal Conductivity of Cu/Diamond Composites by Alloying Boron to the Cu Matrix
dc.type.genrearticle

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